Liquid Submersion PC (Reactor)
Showing posts with label Cooling Tower Pc. Show all posts
Showing posts with label Cooling Tower Pc. Show all posts
Saturday, 11 June 2011
Liquid Submersion PC (Reactor)
Cooling Tower Design
Cooling Tower Design
Archive for the ‘computer water cooling’ Category
computer water cooling
? ? Causes of heat build up?
The amount of heat generated by an integrated circuit (e.g., a CPU or GPU), the prime cause of heat build up in modern computers, is a function of the efficiency of its design, the technology used in its construction and the frequency and voltage at which it operates.?
The dust on the laptop CPU heat sink after three years of use has made the laptop unusable due to frequent thermal shutdowns.?
In operation, the temperature levels of a computer’s components will rise until the temperature slope between the computer parts and their surroundings is such that the rate astatine which heat is lost to the surroundings is equal to the rate at which heat is being produced by the electronic component, and thus the temperature of the component reaches equilibrium.?
For reliable operation, the equilibrium temperature moldiness be sufficiently low for the structure of the computer’s circuits to survive.?
Additionally, the normal operation of cooling methods can be hindered by other causes, such as:?
Dust acting as a thermal nonconductor and impeding airflow, thereby reducing heat sink and fan performance.?
Poor airflow including turbulence due to friction against impeding components, or improper orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case.?
Poor heat transfer due to a lack or poor application of thermal compounds.?
Damage prevention?
It is common practice to admit thermal sensors in the design of certain computer parts, e.g. CPUs and GPUs, along with internal logic that shuts down the computer if reasonable bounds ar exceeded. It is, however, unwise to rely on such preventative measures, as it is non universally implemented, and may not prevent perennial incidents from permanently damaging the integrated circuit.?
The design of an integrated circuit may also incorporate features to shut down parts of the circuit when it is idling, or to scale back the clock speed under low workloads or high temperatures, with the goal of reduction both power use and heat generation.?
System cooling?
Fan from Papst for racks.?
Air cooling?
Further information: Computer fan?
While any method used to move air around or to computer enclosures would count as air cooling, fans are by far the most commonly used implement for accomplishing that task. The term computer fan usually refers to fans attached to computer enclosures, but may also be intended to signify any other computer fan, such as a CPU fan, GPU fan, a chipset fan, PSU fan, HDD fan, or PCI slot fans. Common fan sizes include 40, 60, 80, 92, 120, and 140 mm. Recently, 200mm fans have begun to creep into the performance market, as well as even larger sizes such as 230 and 240mm.?
In desktops?
Typical airflow through a background ATX case.?
Desktop computers typically use one or more fans for heat management. Almost all background power supplies have astatine least one fan to exhaust air from the case. Most manufacturers recommend bringing cool, fresh air in astatine the bottom front of the case, and exhausting warm air from the top rear.?
If there is more air being forced into the system than being pumped out (due to an imbalance in the number of fans), this is referred to as a “positive” airflow, as the pressure inside the unit would be higher than outside. A balanced or neutral airflow is the most efficient[citation needed], although a slightly positive airflow results in less dust build up if dust filters are used. Negative pressure inside the case can create problems such as choked optical drives due to sucking in air (and dust).?
In high density computing?
Data centers typically contain many racks of flat 1U servers. Air is drawn in astatine the front of the rack and exhausted astatine the rear. Because data centers typically contain such large numbers of computers and other power-consuming devices, they risk overheating of the various components if no extra measures ar taken. Thus, extensive HVAC systems are used. Often a raised floor is used so the area under the floor may be used as a large plenum for cooled air and power cabling.?
Another way of accommodating large numbers of systems in a small space are blade chassis. In contrast to the horizontal orientation of flat servers, blade chassis are often oriented vertically. This vertical orientation facilitates convection. When the air is heated by the hot components, it tends to flow to the top on its own, creating a natural air flow along the boards. This stack effect can help to achieve the desired air flow and cooling. Some manufacturers expressly take vantage of this effect.?
In laptop computing?
Most laptops use air cooling in order to keep the CPU and other components within their operating temperature range. Because the air is fan forced through a small port, it can clog the fan and heatsinks with dust or be obstructed by objects placed near the port. This can cause overheating, and can be a cause of component failure in laptops. The severity of this job varies with laptop design, its use and power dissipation. With recent reductions in CPU power dissipation, this job can be awaited(p) to reduce in severity.?
Liquid submersion cooling?
An uncommon practice is to submerge the computer’s components in a thermally conductive liquid. Personal computers that ar cooled in this manner do non generally require any fans or pumps, and may be cooled exclusively by passive heat exchange ‘tween the computer’s parts, the cooling fluid and the ambient air. Extreme density computers such as the Cray-2 may use extra radiators in order to facilitate heat exchange.?
The liquid used mustiness have sufficiently low electric conduction in order for it not to interfere with the normal operation of the computer’s components. If the liquid is somewhat electrically conductive, it may be necessary to isolate certain parts of components susceptible to electromagnetic interference, such as the CPU. For these reasons, it is preferred that the liquid be dielectric.?
Liquids commonly used in this manner admit various liquids invented and manufactured for this purpose by 3M, such as Fluorinert. Various oils, including but non limited to cooking, motor and silicone oils have all been successfully used for cooling personal computers.?
Evaporation can pose a problem, and the liquid may require either to be regularly refilled or certain inside the computer’s enclosure. Liquid may also slowly seep into and damage components, particularly capacitors, causation an initially functional computer to fail after hours or days immersed.?
Waste heat reduction?
Where full-power, full-featured modern computers ar non required, some companies choose to use less powerful computers or computers with fewer features. For example: in an office setting, the IT section may choose a thin client or a diskless workstation thus cutting out the heat-laden components such as hard drives and optical disks. These devices are also often powered with direct current from an external power supply brick which still wastes heat, but not inside the computer itself.?
The components used can greatly affect the power consumption and hence waste heat. A VIA EPIA motherboard with CPU typically generates approximately 25 watts of heat whereas a Pentium 4 motherboard typically generates around 140 watts. While the former has considerably less computing power, both types are adequate and antiphonal for tasks such as word processing and spreadsheets. Choosing a LCD monitor rather than a CRT can also reduce power consumption and excess room heat, as well as the added benefit of increasing available physical desk space.?
Conductive and radiative cooling?
Some laptop components, such as hard drives and optical drives, are commonly cooled by having them make contact with the computer’s frame, increasing the surface area which can radiate and differently exchange heat.?
Spot cooling?
In addition to system cooling, various individual components usually have their own cooling systems in place. Components which ar individually cooled include, but are non limited to, the CPU, GPU and the Northbridge chip. Some cooling solutions employ one or more methods of cooling, and may also utilize logic and/or temperature sensors in order to vary the power used in active cooling components.?
Passive heat sink cooling?
Passive heatsink fitted on a Intel GMA graphics chip?
Passive heat sink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used, or more commonly for a personal computer CPU, a clinch is used to affix the heat sink right over the chip, with a thermal grease or pad spread between. This block usually has fins and ridges to increase its surface area. The heat conductivity of metal is much better than that of air, and its ability to radiate heat is better than that of the component part it is protecting (usually an integrated circuit or CPU). Until recently, fan cooled aluminium heat sinks were the norm for background computers. Today many heat sinks feature copper base-plates or are entirely made of copper, and mount fans of considerable size and power.?
Heat sinks tend to get less effective with time due to the build up of dust between their metal fins, which reduces the efficiency with which the heat sink transfers heat to the ambient air. Dust build up can be countered with a gas duster by blowing away the dust along with any other unwanted excess material.?
Passive heat sinks are commonly found on older CPUs, parts that do non get very hot (such as the chipset), and low-power computers.?
Usually a heatsink is attached to the integrated heat broadcaster (IHS). It basically is a large flat plate attached to the CPU (with conductivity paste layered between). The plate is used to dissipate or spread the heat locally. Unlike a heatsink, its intent is to redistribute heat and not to remove it. In addition, the IHS offers protection to the fragile CPU.?
Passive cooling avoids the generation of fan noise.?
Active heat sink cooling?
Active heatsink with a 120mm fan located inside the unit and attached fan controller in background?
Active heat sink cooling uses the same principle as passive, with the addition of a fan that is directed to blow over or through the heat sink. The moving air increases the rate at which the heat sink can exchange heat with the ambient air. Active heat sinks ar the primary method of cooling a modern processor or graphics card.?
The buildup of dust is greatly increased with active heat sink cooling as the fan is continually taking in the dust present in the surrounding air. As a result, dust removal procedures need to be exercised much more frequently than with passive heat sink methods.?
Peltier cooling or thermoelectric cooling?
Main article: Thermoelectric cooling?
In 1821 T. J. Seebeck discovered that different metals, connected at two different junctions, will develop a micro-voltage if the two junctions are held at different temperatures. This effect is known as the “Seebeck effect”; it is the basic theory behind the TEC (thermoelectric cooling).?
In 1834 Jean Peltier discovered the inverse of the Seebeck effect, now known as the “Peltier effect”. He found that applying a voltage to a thermocouple creates a temperature differential between two sides. This results in an effective, albeit extremely inefficient heat pump.?
Modern TECs use several stacked units each composed of dozens or hundreds of thermocouples laid out next to each other, which allows for a substantial amount of heat transfer. A combining of bi and telluride is most commonly used for thermocouples.?
Since TECs ar active heat pumps, they ar capable of cooling PC components below ambient temperatures, which is impossible with common radiator cooled water cooling systems and heatpipe HSFs.?
Water cooling?
Main article: Water cooling?
While originally limited to mainframe computers, water cooling has become a practice largely associated with overclocking in the form of either manufactured kits, or in the form of do-it-yourself setups assembled from individually collected parts. The past few years has seen water cooling increasing its popularity with pre-assembled, moderate to high performance, desktop computers. Water has the ability to dissipate more heat from the cooled parts than the various types of metals used in heatsinks, making it suitable for overclocking and high performance computer applications. Advantages to water cooling admit the fact that a system is non limited to cooling one component, but can be set up to cool the central processing unit, graphics processing unit, and/or other components astatine the same time with the same system. As opposed to air cooling, water cooling is also influenced less by the ambient temperature. Water cooling’s relatively low noise-level is also favorable to that of active cooling, which can become quite noisy. One disadvantage to water cooling is the potential for a coolant leak. Leaked coolant can damage any electronic components it comes in contact with. Another drawback to water cooling is the complexness of the system; an active heat sink is much simpler to build, install, and maintain than a water cooling solution.?
DIY Water cooling setup showing 12v pump, CPU Waterblock and the typical application of a T-Line?
DIY Water cooling apparatus showing 12v MCP655 Vario pump, Swiftech GTZ CPU Waterblock and the non-typical use of a Reservoir.?
Heat pipe?
Main article: Heat pipe?
A graphics card with a heatpipe cooler design.?
A heat pipe is a hollow tube containing a heat transfer liquid. As the liquid evaporates, it carries heat to the cool end, where it condenses and then returns to the hot end (under capillary action, or, in earlier implementations, under gravitation). Heat pipes thus have a much higher effective thermal conduction than solid materials. For use in computers, the heat sink on the CPU is attached to a larger radiator heat sink. Both heat sinks are hollow as is the attachment ‘tween them, creating one large heat pipe that transfers heat from the CPU to the radiator, which is then cooled using some conventional method. This method is expensive and usually used when space is tight (as in small form-factor PCs and laptops), or absolute quiet is needed (such as in computers used in audio production studios during live recording). Because of the efficiency of this method of cooling, many desktop CPU’s and GPU’s, as well as high end chipsets, use heat pipes in addition to active fan-based cooling to remain within safe operating temperatures.?
Archive for the ‘computer water cooling’ Category
computer water cooling
The amount of heat generated by an integrated circuit (e.g., a CPU or GPU), the prime cause of heat build up in modern computers, is a function of the efficiency of its design, the technology used in its construction and the frequency and voltage at which it operates.?
The dust on the laptop CPU heat sink after three years of use has made the laptop unusable due to frequent thermal shutdowns.?
In operation, the temperature levels of a computer’s components will rise until the temperature slope between the computer parts and their surroundings is such that the rate astatine which heat is lost to the surroundings is equal to the rate at which heat is being produced by the electronic component, and thus the temperature of the component reaches equilibrium.?
For reliable operation, the equilibrium temperature moldiness be sufficiently low for the structure of the computer’s circuits to survive.?
Additionally, the normal operation of cooling methods can be hindered by other causes, such as:?
Dust acting as a thermal nonconductor and impeding airflow, thereby reducing heat sink and fan performance.?
Poor airflow including turbulence due to friction against impeding components, or improper orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case.?
Poor heat transfer due to a lack or poor application of thermal compounds.?
Damage prevention?
It is common practice to admit thermal sensors in the design of certain computer parts, e.g. CPUs and GPUs, along with internal logic that shuts down the computer if reasonable bounds ar exceeded. It is, however, unwise to rely on such preventative measures, as it is non universally implemented, and may not prevent perennial incidents from permanently damaging the integrated circuit.?
The design of an integrated circuit may also incorporate features to shut down parts of the circuit when it is idling, or to scale back the clock speed under low workloads or high temperatures, with the goal of reduction both power use and heat generation.?
System cooling?
Fan from Papst for racks.?
Air cooling?
Further information: Computer fan?
While any method used to move air around or to computer enclosures would count as air cooling, fans are by far the most commonly used implement for accomplishing that task. The term computer fan usually refers to fans attached to computer enclosures, but may also be intended to signify any other computer fan, such as a CPU fan, GPU fan, a chipset fan, PSU fan, HDD fan, or PCI slot fans. Common fan sizes include 40, 60, 80, 92, 120, and 140 mm. Recently, 200mm fans have begun to creep into the performance market, as well as even larger sizes such as 230 and 240mm.?
In desktops?
Typical airflow through a background ATX case.?
Desktop computers typically use one or more fans for heat management. Almost all background power supplies have astatine least one fan to exhaust air from the case. Most manufacturers recommend bringing cool, fresh air in astatine the bottom front of the case, and exhausting warm air from the top rear.?
If there is more air being forced into the system than being pumped out (due to an imbalance in the number of fans), this is referred to as a “positive” airflow, as the pressure inside the unit would be higher than outside. A balanced or neutral airflow is the most efficient[citation needed], although a slightly positive airflow results in less dust build up if dust filters are used. Negative pressure inside the case can create problems such as choked optical drives due to sucking in air (and dust).?
In high density computing?
Data centers typically contain many racks of flat 1U servers. Air is drawn in astatine the front of the rack and exhausted astatine the rear. Because data centers typically contain such large numbers of computers and other power-consuming devices, they risk overheating of the various components if no extra measures ar taken. Thus, extensive HVAC systems are used. Often a raised floor is used so the area under the floor may be used as a large plenum for cooled air and power cabling.?
Another way of accommodating large numbers of systems in a small space are blade chassis. In contrast to the horizontal orientation of flat servers, blade chassis are often oriented vertically. This vertical orientation facilitates convection. When the air is heated by the hot components, it tends to flow to the top on its own, creating a natural air flow along the boards. This stack effect can help to achieve the desired air flow and cooling. Some manufacturers expressly take vantage of this effect.?
In laptop computing?
Most laptops use air cooling in order to keep the CPU and other components within their operating temperature range. Because the air is fan forced through a small port, it can clog the fan and heatsinks with dust or be obstructed by objects placed near the port. This can cause overheating, and can be a cause of component failure in laptops. The severity of this job varies with laptop design, its use and power dissipation. With recent reductions in CPU power dissipation, this job can be awaited(p) to reduce in severity.?
Liquid submersion cooling?
An uncommon practice is to submerge the computer’s components in a thermally conductive liquid. Personal computers that ar cooled in this manner do non generally require any fans or pumps, and may be cooled exclusively by passive heat exchange ‘tween the computer’s parts, the cooling fluid and the ambient air. Extreme density computers such as the Cray-2 may use extra radiators in order to facilitate heat exchange.?
The liquid used mustiness have sufficiently low electric conduction in order for it not to interfere with the normal operation of the computer’s components. If the liquid is somewhat electrically conductive, it may be necessary to isolate certain parts of components susceptible to electromagnetic interference, such as the CPU. For these reasons, it is preferred that the liquid be dielectric.?
Liquids commonly used in this manner admit various liquids invented and manufactured for this purpose by 3M, such as Fluorinert. Various oils, including but non limited to cooking, motor and silicone oils have all been successfully used for cooling personal computers.?
Evaporation can pose a problem, and the liquid may require either to be regularly refilled or certain inside the computer’s enclosure. Liquid may also slowly seep into and damage components, particularly capacitors, causation an initially functional computer to fail after hours or days immersed.?
Waste heat reduction?
Where full-power, full-featured modern computers ar non required, some companies choose to use less powerful computers or computers with fewer features. For example: in an office setting, the IT section may choose a thin client or a diskless workstation thus cutting out the heat-laden components such as hard drives and optical disks. These devices are also often powered with direct current from an external power supply brick which still wastes heat, but not inside the computer itself.?
The components used can greatly affect the power consumption and hence waste heat. A VIA EPIA motherboard with CPU typically generates approximately 25 watts of heat whereas a Pentium 4 motherboard typically generates around 140 watts. While the former has considerably less computing power, both types are adequate and antiphonal for tasks such as word processing and spreadsheets. Choosing a LCD monitor rather than a CRT can also reduce power consumption and excess room heat, as well as the added benefit of increasing available physical desk space.?
Conductive and radiative cooling?
Some laptop components, such as hard drives and optical drives, are commonly cooled by having them make contact with the computer’s frame, increasing the surface area which can radiate and differently exchange heat.?
Spot cooling?
In addition to system cooling, various individual components usually have their own cooling systems in place. Components which ar individually cooled include, but are non limited to, the CPU, GPU and the Northbridge chip. Some cooling solutions employ one or more methods of cooling, and may also utilize logic and/or temperature sensors in order to vary the power used in active cooling components.?
Passive heat sink cooling?
Passive heatsink fitted on a Intel GMA graphics chip?
Passive heat sink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used, or more commonly for a personal computer CPU, a clinch is used to affix the heat sink right over the chip, with a thermal grease or pad spread between. This block usually has fins and ridges to increase its surface area. The heat conductivity of metal is much better than that of air, and its ability to radiate heat is better than that of the component part it is protecting (usually an integrated circuit or CPU). Until recently, fan cooled aluminium heat sinks were the norm for background computers. Today many heat sinks feature copper base-plates or are entirely made of copper, and mount fans of considerable size and power.?
Heat sinks tend to get less effective with time due to the build up of dust between their metal fins, which reduces the efficiency with which the heat sink transfers heat to the ambient air. Dust build up can be countered with a gas duster by blowing away the dust along with any other unwanted excess material.?
Passive heat sinks are commonly found on older CPUs, parts that do non get very hot (such as the chipset), and low-power computers.?
Usually a heatsink is attached to the integrated heat broadcaster (IHS). It basically is a large flat plate attached to the CPU (with conductivity paste layered between). The plate is used to dissipate or spread the heat locally. Unlike a heatsink, its intent is to redistribute heat and not to remove it. In addition, the IHS offers protection to the fragile CPU.?
Passive cooling avoids the generation of fan noise.?
Active heat sink cooling?
Active heatsink with a 120mm fan located inside the unit and attached fan controller in background?
Active heat sink cooling uses the same principle as passive, with the addition of a fan that is directed to blow over or through the heat sink. The moving air increases the rate at which the heat sink can exchange heat with the ambient air. Active heat sinks ar the primary method of cooling a modern processor or graphics card.?
The buildup of dust is greatly increased with active heat sink cooling as the fan is continually taking in the dust present in the surrounding air. As a result, dust removal procedures need to be exercised much more frequently than with passive heat sink methods.?
Peltier cooling or thermoelectric cooling?
Main article: Thermoelectric cooling?
In 1821 T. J. Seebeck discovered that different metals, connected at two different junctions, will develop a micro-voltage if the two junctions are held at different temperatures. This effect is known as the “Seebeck effect”; it is the basic theory behind the TEC (thermoelectric cooling).?
In 1834 Jean Peltier discovered the inverse of the Seebeck effect, now known as the “Peltier effect”. He found that applying a voltage to a thermocouple creates a temperature differential between two sides. This results in an effective, albeit extremely inefficient heat pump.?
Modern TECs use several stacked units each composed of dozens or hundreds of thermocouples laid out next to each other, which allows for a substantial amount of heat transfer. A combining of bi and telluride is most commonly used for thermocouples.?
Since TECs ar active heat pumps, they ar capable of cooling PC components below ambient temperatures, which is impossible with common radiator cooled water cooling systems and heatpipe HSFs.?
Water cooling?
Main article: Water cooling?
While originally limited to mainframe computers, water cooling has become a practice largely associated with overclocking in the form of either manufactured kits, or in the form of do-it-yourself setups assembled from individually collected parts. The past few years has seen water cooling increasing its popularity with pre-assembled, moderate to high performance, desktop computers. Water has the ability to dissipate more heat from the cooled parts than the various types of metals used in heatsinks, making it suitable for overclocking and high performance computer applications. Advantages to water cooling admit the fact that a system is non limited to cooling one component, but can be set up to cool the central processing unit, graphics processing unit, and/or other components astatine the same time with the same system. As opposed to air cooling, water cooling is also influenced less by the ambient temperature. Water cooling’s relatively low noise-level is also favorable to that of active cooling, which can become quite noisy. One disadvantage to water cooling is the potential for a coolant leak. Leaked coolant can damage any electronic components it comes in contact with. Another drawback to water cooling is the complexness of the system; an active heat sink is much simpler to build, install, and maintain than a water cooling solution.?
DIY Water cooling setup showing 12v pump, CPU Waterblock and the typical application of a T-Line?
DIY Water cooling apparatus showing 12v MCP655 Vario pump, Swiftech GTZ CPU Waterblock and the non-typical use of a Reservoir.?
Heat pipe?
Main article: Heat pipe?
A graphics card with a heatpipe cooler design.?
A heat pipe is a hollow tube containing a heat transfer liquid. As the liquid evaporates, it carries heat to the cool end, where it condenses and then returns to the hot end (under capillary action, or, in earlier implementations, under gravitation). Heat pipes thus have a much higher effective thermal conduction than solid materials. For use in computers, the heat sink on the CPU is attached to a larger radiator heat sink. Both heat sinks are hollow as is the attachment ‘tween them, creating one large heat pipe that transfers heat from the CPU to the radiator, which is then cooled using some conventional method. This method is expensive and usually used when space is tight (as in small form-factor PCs and laptops), or absolute quiet is needed (such as in computers used in audio production studios during live recording). Because of the efficiency of this method of cooling, many desktop CPU’s and GPU’s, as well as high end chipsets, use heat pipes in addition to active fan-based cooling to remain within safe operating temperatures.?
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